Physics CM/BIO/ECE Seminar Series

Wednesday, October 17, 2018 4:00pm

223A Physics Bldg. Library


Assistant Professor Zheng Yan

The MU Physics & Astronomy Department’s Condensed Matter - Biological Physics - Electrical & Computer Engineering seminar series presents, "Materials and Manufacturing Innovations for Next-Generation Soft Electronics," by Assistant Professor Zheng Yan, Dept. of Biomedical, Biological & Chemical Engineering and Dept. of Mechanical & Aerospace Engineering, University of Missouri, Wednesday, October 17, 4:00 pm..

Prof. Yan writes, "Innovations that eliminate the mismatch between soft biological tissues and rigid conventional devices will create soft electronic systems, which can find wide applications in clinical human healthcare, fundamental biomedical studies, human-machine interfaces, robotics, athletic training, and many others. Currently, soft electronics can be achieved by employing intrinsically-soft organic electronic materials, flexible and stretchable forms of inorganic electronic materials, or emerging nanomaterials. The further development of soft electronics needs the introduction of some new attributes. For example, they need to be gas-permeable to facilitate perspiration evaporation and biofluids transport, thereby minimizing immune responses and inflammation risks. They should have programmed three-dimensional (3D) structures to interact with biological tissues through the volume. In this context, I will first introduce our recent research results of developing gas-permeable, multifunctional on-skin bioelectronic sensing platforms using porous graphene as device components and using PDMS sponges as substrates. The device examples include electrophysiological sensors, temperature sensors, hydration sensors and joule-heating elements, which demonstrate comparable performances to conventional, rigid, gas-impermeable devices. Secondly, I will introduce our recently-developed mechanically-guided assembly approach of building 3D structures and devices with programmed geometries and unprecedented flexibility and stretchability. The 3D assembly process is naturally compatible with existing planar micro/nanosystems technologies. It provides a fast, powerful means for building complex, programmed 3D structures and devices of advanced materials in a parallel fashion spanning length scales from sub-micrometer to meter dimensions. The application demonstrations include reconfigurable inductors, 3D photodetectors, electronic cellular scaffolds, implantable biomechanical energy harvesters, 3D supercapacitors, and several others."

Refreshments will be served at a pre-talk reception at 3:30 p.m.